G.A.: 101138427

MULTIMOLD

Multi-functional In-Mold Electronics 

START:                    1 January 2024

END:                     31 Dicember 2027

In-mold electronics includes several sub-processes, most of which have a high yield, yet overmolding which is crucial for the production of complex products provides a lower yield and requires expensive tooling and high optimization costs.

The MULTIMOLD project aims to address these limitations by developing a next-generation manufacturing process for products with complex geometries based on in-mold electronics and enabling the use of recyclable materials, integrating advanced electronic functionality, multimodal sensors, haptic feedback, and more The goal is to enhance the user experience and help meet sustainability requirements in various applications. 

Syxis in the project:

In Multimold, Syxis will be responsible for the development and constant update of the data management plan ensuring that the project’s results and outcomes are managed in compliance with the FAIR principles. 

Moreover, Syxis will be responsible for the management of time-series data resulting from the simulations conducted on the 1st GEN demostrators and for the deployment of rEUse for track and trace in support of the Digital Product Passport development.